• NVIDIA Jetson Orin NX 8 GB/16 GB または Nano 8 GB/4 GB GPU （32 Tensor コア）
• 1x HDMI 4K, 3840 x 2160 @ 60Hz
• 4x GbE RJ45 LAN （PoE オプションあり）
• 1x External Dual Nano SIM socket
• 1x M.2 (M Key, 2242/2280, PCIex 4,NVMeサポート)
• 4x USB 3.2 Gen 2, 1x USB Type-C
• 8x DI + 8x DO （アイソレーション対応）
• 9 – 36VDC ワイドレンジ電源対応、AT/ATXモード対応
• 拡張温度対応（-20°C to 55°C） (25W, NXモジュール搭載時)
| System | |
| Processor | – NVIDIA® Jetson Orin™ NX/Nano GPU with 32 Tensor Cores • 16 GB: 1024-core NVIDIA Ampere architecture GPU (25W/100 TOPS) • 8 GB: 1024-core NVIDIA Ampere architecture GPU (20W/70 TOPS) • 8 GB: 1024-core NVIDIA Ampere architecture GPU (15W/40 TOPS) • 4 GB: 512-core NVIDIA Ampere architecture GPU (10W/20 TOPS) |
| LAN Chipset | GbE1: RGMII GbE2-4: Intel LAN Chip |
| Display | |
| HDMI | 1x HDMI 4K (3840*2160) 60Hz |
| Storage | |
| M.2 | 1x M.2 (M Key, 2242/2280, PCIe x4, NVMe) (Default 128GB) |
| SIM Socket | 1x External Dual Nano SIM socket (M.2 B Key attached) |
| Expansion | |
| M.2 | 1x M.2 (B Key, 3042/3052, USB 3.2 Gen1, Support 4G/5G/Storage) 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth) |
| I/O | |
| CAN | CAN 2.0 B |
| COM | 2x RS-232/422/485 (Switch by MCU) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 4x RJ45 LAN |
| OOB | 1x RJ45 (Optional OOB Management Module, Optional, Occupied 1x COM) |
| PoE | 4x RJ45 (Optional, PoE+ 120W Module (Type 2, Max 25W per Port) |
| USB | 4x USB 3.2 Gen 2 (10 Gbps, Shared with USB 3 Hub) 1x USB Type-C |
| Others | 6x WiFi Antenna Holes 1x Power Switch 1x CMOS Battery Cable 1x 4-Pin FAN Connector |
| Operating System | |
| Linux | Linux Ubuntu 20.04 with JetPack |
| Power | |
| Power Adapter | Optional AC/DC 12V/5A, 60W (Optional) Optional AC/DC 24V/9.2A, 220W (For PoE Model) |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Adjustable Power Ignition Management |
| Power Supply Voltage | 9~36VDC 12~36VDC (PoE Model) |
| Power Connector | 3-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection); OCP (Over Current Protection) Reverse Protection |
| Physical | |
| Dimensions | 192 (W) x 140(D) x 58(H) mm |
| Weights | 2.8 ~ 3.6 kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting/DIN rail (Optional) |
| Environment | |
| Operating Temperature | -20°C to 55°C (25W, NX Module) -20°C to 60°C (15W, Nano Module) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | EMI: |
| • CE • FCC Class A (47 CFR part 15.109 and part 15.107) • ICES-003 • UKCA |
|
| EMC Compliance: | |
| • Railway EMC: EN 50155: 2017, EN 50121-1: 2017, EN 50121-3-2: 2016 • Industrial EMC: EN 61000-4-2: 2009, EN IEC 61000-4-3: 2020, EN 61000-4-4: 2012, EN 61000-4-5: 2014 +A1: 2017, EN 61000-4-6: 2014 • E-Mark (E13) |
|
| Safety: | |
| • UL Safety Pending: UL62368-1, 3rd Ed., (cULus) • Test procedure: CB Scheme • Standard: IEC 62368-1:2018 |
|
| Green Product: | |
| • RoHS 3.0 (Directive 2015/863/EU) • REACH |
|
| Vibration | IEC60068-2-64:2008 With SSD: 5 Grms (5 – 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I Package Drop Test: ISTA 2A |
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