| Processor |
Standard
13th Gen Intel® Core™ Processors (Raptor Lake-S)
– Intel® Core™ i7-13700TE, 35W
– Intel® Core™ i5-13500TE, 35W
12th Gen Intel® Core™ Processors (Alder Lake-S)
– Intel® Core™ i7-12700TE, 35W
– Intel® Core™ i5-12500TE, 35W
Project Based
– Intel® Core™ 3 / 5 / 7 (Series 2, Bartlett Lake-S, 45W)
– 14th Gen Intel® Core™ i3 / i5 / i7 / i9 (Raptor Lake-S Refresh, 35W)
– 13th Gen Intel® Core™ i3 / i5 / i7 / i9 (Raptor Lake-S, 35W)
– 12th Gen Intel® Core™ i3 / i5 / i7 / i9 (Alder Lake-S, 35W) |
| System Chipset |
Intel® Q670E Express Chipset |
| LAN Chipset |
2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)
2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN) |
| Audio Codec |
Realtek ALC888S |
| System Memory |
1x DDR5 4800/5600 MT/s SO-DIMM Max. 48GB |
| Graphics |
Integrated Intel® UHD Graphics 770/730 |
| BIOS |
AMI 256Mbit SPI BIOS |
| Watchdog |
Software Programmable Supports 1~255 sec. System Reset |
| AI Accelerator |
Supports up to 4x Hailo-8™ modules |
| TPM |
TPM 2.0 |
| Display Port |
4x DisplayPort 1.4a, support resolution 4096 x 2304,
Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector) |
| HDMI |
Yes, Shared by 1x DP port |
| Multiple Display |
4x Independent Displays |
| SSD/HDD |
1x 9mm 2.5″ SATA SSD Bay (Internal)
1x 7mm 2.5″ SATA SSD Bay (Hot-swappable)
Support RAID 0, 1, 5 |
| M.2 B-Key |
1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/PCIe x1 & USB 3.2 Gen1
• Support NVMe Storage/Hailo AI Module/4G/5G
1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/SATA signal
• Support NVMe/SATA Storage/Hailo AI Module/4G |
| M.2 E-Key |
1x M.2 E key slot (2230)
• Support PCIe x1 & USB 2.0; Support CNVi
• Support Wifi Module |
| SIM Socket |
1x External Mini SIM socket
1x External Dual Nano SIM socket |
| Expansion Modules |
EDGEBoost I/O Bracket:
• 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
• 2-Port 10GbE RJ45 with Intel X710 Chipset
• 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth)
• 1x RJ45 port for OOB Management Module
• 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module
• 2x M.2 B-Key 2242/3042/3052:
– 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or
– 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached) |
| Audio |
1x Line-out |
| CAN |
2x CAN 2.0 A/B 2-pin Internal header |
| COM |
3x RS-232/422/485; 2x RS-232/422/485 Internal header |
| DIO |
8 in / 8 out (Isolated) |
| LAN |
2x 2.5GbE RJ45 |
| USB |
6x USB 3.2 Gen 2 (10Gbps) |
| Others |
5x WiFi Antenna Holes
1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/Car Mode Switch, 1x Delay Time Switch
1x Clear CMOS Switch
1x Mic In Header (Internal) |
| Windows |
Windows 10/11 |
| Linux |
Linux kernel 5.x |
| Power Adapter |
Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67A, 280W |
| Power Mode |
AT, ATX |
| Power Ignition Sensing |
Power Ignition Management |
| Power Supply Voltage |
9~48VDC |
| Power Connector |
3-pin Terminal Block |
| Power Protection |
OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection |
| Operating Temperature |
-25°C to 70°C (35W/45W CPU) |
| Storage Temperature |
-30°C to 85°C |
| Relative Humidity |
10% to 95% (non-condensing) |
| Certification |
UL 61010-1, 3rd Ed
UL 61010-2-201, Edition 2
CE, FCC Class A
EMC Conformity with EN50121-3-2 |
| Vibration |
With HDD: 1 Grms (5 – 500 Hz, 0.5 hr/axis)
With SSD: 5 Grms (5 – 500 Hz, 0.5 hr/axis) |
| Shock |
With SSD: 50G half-sin 11ms |
| Dimensions |
192 (W) x 227 (D) x 69.5 (H) mm |
| Weights |
5 – 5.4KG |
| Construction |
Extruded Aluminum with Heavy Duty Metal |
| Mounting Options |
Wall Mounting kit with Vibration Isolation
DIN Rail Mounting (optional) |